LEC-2290
Intelligent Edge Computing Box PC w/ Support for Intel® Core™ i7-8700T/i7-8700 and Intel® Xeon® E-2278GEL
Key Features
- Intel® Core™ i7-8700T/i7-8700 & Intel® Xeon® E-2278GEL
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B Key M.2 w/ Nano-SIM
Order Information
| LEC-2290A | Support Intel® Core™ i FCLGA1152 (Coffee Lake S) or Intel® Xeon® E-2278GEL CPU w/ 2*DDR4 SO-DIMM, 2*HDMI, 1*DP, 2*GbE LAN, 4*GbE PoE, 6* RS-232/422/485, 4*USB 3.0, DIO, Audio, 1*mSATA, 2*External 2.5” SATA Drive Bay, 1*MiniPCI-E Slot w/ 1*Sim Card Socket, 1* M.2 Slot w/1*Sim Card Socket, Support 1* Removable M.2 w/ Dual SIM Carrier, 1x PCIe*16 & 1x PCIe*4 Expansion, +9~30VDC Input |
Overview
The LEC-2290, an intelligent edge computing box PC, comes with support for Intel® Core™ i7-8700T/i7-8700 CPU (codenamed Coffee Lake S) and Intel® Xeon® E-2278GEL. This IPC features 2x DDR4 2133/2400 SO-DIMM (Max. 64GB), 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM ports, 8x DI & 8x DO, 2x removable HDD/SSD external slots w/ RAID, 1x mSATA, 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM and 1x B Key M.2 w/ Nano-SIM.
BIOS
Chipset
CPU
AMI 256Mbit SPI Flash BIOS
FH82C246
Support Intel® Core™ i7-8700T/i7-8700 Core i (FCLGA1152), Codenamed Coffee Lake S & Intel® Xeon® E-2278GEL
Ethernet Controller
Graphic Controller
Mini-PCIe
PCIe
Intel i210IT
Intel® UHD Graphics 630
1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM
1x PCIe*16 & 1x PCIe*4
Fanless
Yes
Dimensions (W x H x D)
Operating Temperature
Storage Temperature
Vibration
Weight
275 x 115 x 225 mm
-20°C~55°C (35W CPU), -20°C~45°C (65W CPU)
-40°C~70°C
IEC 60068-2-64, 0.5Grms, random 5 ~500Hz, 40 mins/axis
6.2 KG
Socket
Technology
2x 260-pin SO-DIMM
DDR4 2133/2400 SO-DIMM
IO Interface
2x GbE RJ45, 4x PoE RJ45 @IEEE 802.3at (Total PoE Budget of 60W)
Power Button
Reset Button
USB
1x Power-On
1x Reset Button
Power/Storage/LTE/Wifi
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